HOMEPAGE >> Epoxy resin GLOD
Glod? Series is ultra micro powder dicyandiamide, a latent curing agent, which is used as the curing system of one component epoxy resin formulation system. Narrow and stable particle size distribution, mainly used in high temperature curing system, with standard bisphenol A epoxy (EEW ≈ 190), the recommended proportion of 6-10phr, conventional curing conditions for 180 ℃ / 30min. Different particle sizes can meet different processes and application fields. With our GLOC? Organic urea accelerator, the curing temperature can be further reduced and the curing speed can be accelerated.
Its main features are as follows:
1. Application: prepreg, adhesive, powder coating.
2. Packaging and storage: 6kg / carton, process bag, container bag or customized; sealed in the original container, stored in a cool and dry place, and the storage period shall not exceed 12 months.
Changzhou Promisechem Co., Ltd ,created in March2014.The core business is R&D and sales of special chemicals for high performance composites industry. To feed up the total solutions for the customers, we also served in this market as the distribution of catalyst, additives, pigment powder and auxiliary materials.
